Processing-structure-property-performance (PSPP) of Materials

Facilities & Equipment

Atomic to Micro Scale Microstructural Characterization of Materials

  • Focused Ion Beam/ Scanning Electron Microscope (FIB/FEG-SEM)

  • Transmission Electron Microscope (TEM/HRTEM/STEM)

  • Atomic Force Microscope with a Nano-indenter and PeakForce Quantitative Nanoscale Mechanical Characterization for materials (Electrical/Thermmal properties characterization)

  • Optical Profiler (Contour GT) for surface roughness characterization and measurements

  • Micro Computed Tomography (res: > 20 microns)) Scanner for non-destructive evaluation of the internal microstructure of processed materials (porosity, micro-cracks).

  • X-ray Diffractometer for XRD (grain size, micro-strain, dislocation density, crystal structures, phases, elemental composition)

  • Micro-analysis and Electron Probe Microanalyzer Spectroscopy EPMA (EDS, EDX, EDXS or XEDS),

  • Fourier Transform Infrared (FTIR) Spectroscopy

  • Nano-hardness and Micromet micro-hardness tester

Static, Quasi-Static and High Strain Rate Mechanical Characterization

  • 3D Digital Image Correlation (LaVision StrainMaster 3D DIC) for fatigue, compression tension, torsional and bi-axial tests

  • Direct Impact Hopkinson Pressure Bar coupled with a 3D DIC system for high strain rate compression tests

  • Electrodynamic test frame with temperature test chambers (-80 degrees Celsius to 600 deg C)

  • Universal Mechanical Tester Tribometer for tribological and wear characterization of materials under varying environments (fluid environments, high temperatures and scratch tests)

  • Tension Compression test frames with 3-point bend, 4-point bend and Single Etched Notched Beam (SENB) testing fixtures

  • Biaxial test frames coupled with 3D DIC